ILAPAK has unveiled the industry’s first IP65 rated fully modular HFFS (horizontal form-fill-seal) flowrapper and a ground-breaking gentle feeding device to eliminate breakage of bakery products such as wafers and other similar biscuits.
Bakers using the flexible and future-proof Carrera 6000 will benefit from shorter lead times and lower cost of ownership as a result of the flowrapper’s unique modular design. The Carrera 6000 can be customised by selecting only the modules needed, and can add modules such as film auto-splicing, gusseting, and even a completely new jaw set up, at a later date. The machine’s modularity also makes maintenance quicker and easier, as individual sections can be removed rather than having to dismantle the entire machine.
Complete IP65 protection has been achieved through full stainless steel execution, isolating the electrical cabinet from the main machine frame and smooth, angled surfaces without recesses. This ultra-hygienic construction enables full wash down capability, even of the sealing elements.
The Carrera 6000 is capable of linear speeds of up to 100m/minute. An industrial PC based on a Linux operating system facilitates easy communication via SCADA or a customer’s own network, for performance monitoring, data collection, diagnostic and maintenance purposes.
In its standard configuration typical applications include buns, biscuits, flat breads, morning goods, sliced bread, crackers and other typical bakery products. Once fitted with the revolutionary new gentle feeding module the Carrera 6000 is capable of eliminating breakage of bakery products such as a wafer and other similar biscuits
Traditional feeding solutions for wafers for example involved the use of a cross belt feeder in which indexing plates pushed groups of wafers at a 90° angle, short-side leading, into the chain. This method placed limitations on speed and any wafers whose layers were misaligned were prone to breakage.
ILAPAK has conceived an in-line solution in which an elevating system lifts groups of delicate products like wafers from beneath and deposits them onto a conveyor which transports them forwards into the chain, long-side leading, without the need for a 90° movement.
This gentler transfer coupled with continuous feeding allows the delicate wafers to be wrapped at speeds of up to 250ppm without the risk of breakage.
Manufacturers have the option of packaging their delicate product either lengthwise or transversely into the pack.
ILAPAK has also designed a servo-driven gusseting device to ensure high quality pack presentation for wafers. This gives greater flexibility to fine-tune the folding of the cross-seal to match the dimensions of the product more closely.